Electron microscopy characterization of Au/Ni contacts to p-type InP
Identifieur interne : 000547 ( Main/Exploration ); précédent : 000546; suivant : 000548Electron microscopy characterization of Au/Ni contacts to p-type InP
Auteurs : RBID : ISTEX:11664_1988_Article_BF02652121.pdfEnglish descriptors
Abstract
The change in contact resistance produced by annealing Au/Ni metallizations top-type InP, has been correlated to the microstructural changes by means of electron microscopy techniques. The contacts were initially non-ohmic, but decreased in resistance by a factor of 24 upon annealing to temperatures of up to 400° C. The metallization was quite unstable,i.e. the Ni reacted readily with InP, even during deposition. Annealing was characterized by the formation of a series of Ni-P phases, as well as inward diffusion of Au and outward diffusion of In, which resulted in the formation of Au-In compounds. These reactions aided Ni doping of the InP, leading to the lower contact resistance.
DOI: 10.1007/BF02652121
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Piercy</name><affiliation wicri:level="1"><mods:affiliation>Department of Materials Science and Engineering, McMaster University, Hamilton, Ontario, Canada</mods:affiliation><country xml:lang="fr">Canada</country><wicri:regionArea>Department of Materials Science and Engineering, McMaster University, Hamilton, Ontario</wicri:regionArea><wicri:noRegion>Ontario</wicri:noRegion></affiliation></author></titleStmt><publicationStmt><idno type="RBID">ISTEX:11664_1988_Article_BF02652121.pdf</idno><date when="1988">1988</date><idno type="doi">10.1007/BF02652121</idno><idno type="wicri:Area/Main/Corpus">000195</idno><idno type="wicri:Area/Main/Curation">000195</idno><idno type="wicri:Area/Main/Exploration">000547</idno></publicationStmt></fileDesc><profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Electron microscopy</term><term>Indium phosphide</term><term>Ohmic contacts</term></keywords></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="eng">The change in contact resistance produced by annealing Au/Ni metallizations top-type InP, has been correlated to the microstructural changes by means of electron microscopy techniques. The contacts were initially non-ohmic, but decreased in resistance by a factor of 24 upon annealing to temperatures of up to 400° C. The metallization was quite unstable,i.e. the Ni reacted readily with InP, even during deposition. Annealing was characterized by the formation of a series of Ni-P phases, as well as inward diffusion of Au and outward diffusion of In, which resulted in the formation of Au-In compounds. These reactions aided Ni doping of the InP, leading to the lower contact resistance.</div></front></TEI><mods xsi:schemaLocation="http://www.loc.gov/mods/v3 file:///applis/istex/home/loadistex/home/etc/xsd/mods.xsd" version="3.4" istexId="2121858de2951cbf025d094d06bcc4518a52205b"><titleInfo lang="eng"><title>Electron microscopy characterization of Au/Ni contacts to p-type InP</title></titleInfo><name type="personal"><namePart type="given">D. G.</namePart><namePart type="family">Ivey</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Department of Mining, Metallurgical and Petroleum Engineering, University of Alberta, Edmonton, Alberta, Canada</affiliation></name><name type="personal"><namePart type="given">R.</namePart><namePart type="family">Bruce</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Bell Northern Research, Station C, P.O. Box 3511, Ottawa, Ontario, Canada</affiliation></name><name type="personal"><namePart type="given">G. R.</namePart><namePart type="family">Piercy</namePart><role><roleTerm type="text">author</roleTerm></role><affiliation>Department of Materials Science and Engineering, McMaster University, Hamilton, Ontario, Canada</affiliation></name><typeOfResource>text</typeOfResource><genre>Original Paper</genre><originInfo><publisher>Springer-Verlag, New York</publisher><dateCreated encoding="w3cdtf">1988-02-22</dateCreated><dateValid encoding="w3cdtf">2007-06-15</dateValid><copyrightDate encoding="w3cdtf">1988</copyrightDate></originInfo><language><languageTerm type="code" authority="iso639-2b">eng</languageTerm></language><physicalDescription><internetMediaType>text/html</internetMediaType></physicalDescription><abstract lang="eng">The change in contact resistance produced by annealing Au/Ni metallizations top-type InP, has been correlated to the microstructural changes by means of electron microscopy techniques. The contacts were initially non-ohmic, but decreased in resistance by a factor of 24 upon annealing to temperatures of up to 400° C. The metallization was quite unstable,i.e. the Ni reacted readily with InP, even during deposition. Annealing was characterized by the formation of a series of Ni-P phases, as well as inward diffusion of Au and outward diffusion of In, which resulted in the formation of Au-In compounds. These reactions aided Ni doping of the InP, leading to the lower contact resistance.</abstract><subject lang="eng"><genre>Key words</genre><topic>Ohmic contacts</topic><topic>indium phosphide</topic><topic>electron microscopy</topic></subject><relatedItem type="series"><titleInfo type="abbreviated"><title>JEM</title></titleInfo><titleInfo><title>Journal of Electronic Materials</title><partNumber>Year: 1988</partNumber><partNumber>Volume: 17</partNumber><partNumber>Number: 5</partNumber></titleInfo><genre>Archive Journal</genre><originInfo><dateIssued encoding="w3cdtf">1988-09-01</dateIssued><copyrightDate encoding="w3cdtf">1988</copyrightDate></originInfo><subject usage="primary"><topic>Chemistry</topic><topic>Optical and Electronic Materials</topic><topic>Characterization and Evaluation of Materials</topic><topic>Solid State Physics and Spectroscopy</topic><topic>Electronics and Microelectronics, Instrumentation</topic></subject><identifier type="issn">0361-5235</identifier><identifier type="issn">Electronic: 1543-186X</identifier><identifier type="matrixNumber">11664</identifier><identifier type="local">IssueArticleCount: 20</identifier><recordInfo><recordOrigin>The Metallurgical of Society of AIME, 1988</recordOrigin></recordInfo></relatedItem><identifier type="doi">10.1007/BF02652121</identifier><identifier type="matrixNumber">Art6</identifier><identifier type="local">BF02652121</identifier><accessCondition type="use and reproduction">MetadataGrant: OpenAccess</accessCondition><accessCondition type="use and reproduction">AbstractGrant: OpenAccess</accessCondition><accessCondition type="restriction on access">BodyPDFGrant: Restricted</accessCondition><accessCondition type="restriction on access">BodyHTMLGrant: Restricted</accessCondition><accessCondition type="restriction on access">BibliographyGrant: Restricted</accessCondition><accessCondition type="restriction on access">ESMGrant: Restricted</accessCondition><part><extent unit="pages"><start>373</start><end>380</end></extent></part><recordInfo><recordOrigin>The Metallurgical of Society of AIME, 1988</recordOrigin><recordIdentifier>11664_1988_Article_BF02652121.pdf</recordIdentifier></recordInfo></mods></record>Pour manipuler ce document sous Unix (Dilib)
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